Thermal consideration in PCB fabrication

Question

Hi, 
 I refer to the available information in the gerber files of the ADPA9002 (and HMC8410) evaluation module where it was stated that: "ALL .010 AND .014 THRU VIAS TO BE FILLED WITH NON-CONDUCTIVE EPOXY AND OVERPLATED WITH COPPER, BOTH SIDES." 
 If correctly taking into account the heat generated in the amplifiers, I am wondering how the amplifier and the bottom plate heat sink make excellent thermal contacts if the vias are filled with non-conductive epoxy and not completely filled with copper that has better thermal properties than the epoxy. Can some explanations be given for this fabrication requirements please? 
 For a custom design and fabrication of the PCB, can you please give more detailed explanation of how to affix the PCB to the heatsink. What glue or solder material is suitable?

Dorant · Accepted Answer

Hey obabrin, 
 Included an app note that could assist you were your question regarding heat consideration for PCB. AN-1604 (Rev. 0) (analog.com) /. Hope this helps. 
 In regard to your question on which is better glue or solder for affix PCB to heatsink. That would be rather nuance. It would depend on a multitude of factors such as the weight and size of the heatsink, the thermal requirements of the component, ease of removal for heat sink, etc. It would depends on what you are looking for. 
 Regards, 
 Dorant)

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Thermal consideration in PCB fabrication