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Thermal resistance from Junction to board & junction to case required for HMC516LC5

Iam perfoming thermal analysis of PCB enclosed in enclosure, From datasheet of the component Thermal resistance(channel to die bottom) given is 76.9 °C/W. The value of which i considered is  Thermal resistance from junction to board 

This consideration is because iam performing thermal analysis in Ansys  ICEPAK  in which IC is modelled as a two resistor network

Since these components have exposed pad technically resistance towards board will be less ..my question is my understanding of Resistance towards board is it correct & the how to find resistance towards top of the case

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