HMC998APM5E Thermal resistance channel to package top

Question

Dear AD, 
 I've read the datasheet and found thermal resistance for channel to ground paddle to be 9.1 C/W. I would like to have an estimate of thermal resistance for channel to package top or ground paddle to package top. 
 Can you please help me with this? 
 Kind regards, 
 Richard

Jim · Accepted Answer

Hi Richard, 
 The HMC998APM5E uses a pre-molded plastic air cavity package. The heat path in the device is down through and out the exposed ground paddle. The thermal resistance to the package top would be very high in comparison to the thermal resistance to ground paddle. 
 Regards, 
 Jim B

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HMC998APM5E Thermal resistance channel to package top

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