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HMC998APM5E Production
The HMC998APM5E is a GaAs pHEMT MMIC Distributed Power Amplifier which operates from DC to 22 GHz. The amplifier provides +15 dB of gain, +42 dBm output...
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HMC998APM5E on Analog.com

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HMC998APM5E Thermal resistance channel to package top



		

			

									
					    ricwow
					
							

			
				
									
											
			
			
				
    
			
			
			    	
			                    
                
				                on Feb 2, 2023 
				
			
			
		
    

				
		
    
		    		    
		    
		    		      		            		        
    Category: Datasheet/Specs
    
    		        		            		    
    Product Number:  HMC998APM5E 
    
    		        		    		    	
			
    Dear AD,
    

    I've read the datasheet and found thermal resistance for channel to ground paddle to be 9.1 C/W. I would like to have an estimate of thermal resistance for channel to package top or ground paddle to package top.
    

    Can you please help me with this?
    

    Kind regards,
    

    Richard
    
									
			        
		
    

				
						
        

    
    Tags: 
                                            
                 Datasheet/Specs
                
                                                    
                 amplifiers
                
                                                    
                 hmc998apm5e
                
                                                    
                 rf amplifiers
                
                                                    
                 Wideband Distributed Amplifiers
                
                                
            
    
    
    

		
    
			
						
									
									
						
						
			
			
			
			
		
    

        
        

					
    
			
    


    
















    
	
    
	
    
					



			


				
	









	
      
	

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													+1
							
			
				
									
							        
			
			
			
      •  Analog Employees  
      
            
			                            
                                                                                                                        
            
				
			
            
					
      
	
      

		
		
      
					
      Hi Richard,
      

                            The HMC998APM5E uses a pre-molded plastic air cavity package. The heat path in the device is down through and out the exposed ground paddle. The thermal resistance to the package top would be very high in comparison to the thermal resistance to ground paddle.
      

      Regards,
      

      Jim B
      
			
      

		
			
	      

		
		
	
      
	
      
		
      
			
		
      
	
      
	
      
		
						
				
						
						
				
				
		
		
      
			
		
      
	
      

      

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													+1
							
			
				
									
							        
			
			
			
        
            
			                            
                                                                                                                        
            
				
			
            
												
						in reply to Jim
					
									
        
	
        

		
		
        
					
        Thanks for the reply! I definitely understand that , but if there is some figure or estimate of the thermal resistance from channel to package top or exposed paddle to package to it would be much appreciated to get hold of it since cooling of HMC998 is a potential problem when using supply of 15V Id=500mA.
        

        Kind Regards, Richard
        
			
        

		
			
	      

		
		
	
        
	
        
		
        
			
		
        
	
        
	
        
		
						
						
				
						
				
				
		
		
        
			
		
        
	
        

        

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