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HMC998APM5E Thermal resistance channel to package top

Category: Datasheet/Specs
Product Number: HMC998APM5E

Dear AD,

I've read the datasheet and found thermal resistance for channel to ground paddle to be 9.1 C/W. I would like to have an estimate of thermal resistance for channel to package top or ground paddle to package top.

Can you please help me with this?

Kind regards,


  • Hi Richard,

                          The HMC998APM5E uses a pre-molded plastic air cavity package. The heat path in the device is down through and out the exposed ground paddle. The thermal resistance to the package top would be very high in comparison to the thermal resistance to ground paddle.


    Jim B

  • Thanks for the reply! I definitely understand that , but if there is some figure or estimate of the thermal resistance from channel to package top or exposed paddle to package to it would be much appreciated to get hold of it since cooling of HMC998 is a potential problem when using supply of 15V Id=500mA.

    Kind Regards, Richard