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HMC1019ALP4E -Thermal resistance (theta-JC)

		
	
				

			

									
					    ClaudioPC
					
							

            
            			
				
									
											
			
			
				
    
			
			
			    	
			                    
                
				                on Jan 18, 2023 
				
			
			
		
    
		
		                     
				
        		
    
		    
		    		    
    
		      		            		        
    Category: Hardware
    
    		        		            		    
    Product Number:  HMC1019ALP4E 
    
    		        		    		    
    
		    		    
		    			
    
			    
    Dear AD support,
    

    

    I am looking for the junction thermal resistance at the board in the digital attenuation HMC1019ALP4E, however I would like some help to understand the following values?
    

    The thermal resistance 143.5 °C/W corresponds to the junction-to-board or junction-to-case (top)?
    

    The derated 6.8 mW/°C correspond to the junction-to-board ? For the the thermal analysis when can I use this value?
    

    

     
    

    

    Thank you for your help,
    

    Claudio
    
			
    
			
									    
    
			        
    Edit Notes
    
    				updated titled with product
    
[edited by: Dorant at 4:25 PM (GMT -5) on 18 Jan 2023]
				
    
						
		                             
                        

    
    
                                            
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      •  Analog Employees  
      
            
						
                            
            
            				
            
                on Mar 27, 2023 7:15 AM
            
            
						
			            		
      
		
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      Hi CladioPC
      

      Thanks for the question and apologies for the late reply.
      

      Significant portion of the excess heat (more than ~95%) are transferred through the exposed paddle. Thermal resistance is from junction to the exposed paddle of the package.
      

      The continuous power dissipation spec is referenced to the package ground pad. The derating of Pdiss occurs for every degree C above 85 ambient you are operating the device at.
      

      The process technology and reliability limits may vary from part to part. As long as a good thermal relief is provided by the PCB, maximum operating temperature should be OK to use.
      

      Note that defining the case depends on package itself:

      - If package has exposed(visible) ground paddle, ground paddle is actually case
      - If package does not have exposed(visible) ground paddle but visible lead, lead is actually case.
      

      Thanks
      

      Gokhan
      

      
			
      

		
			
	      

		
		
	
      
	
      
		
      
			
		
      
	
      
	
      
		
						
						
						
				
				
				
		
		
      
			
		
      
	
      

      

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