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HMC661 Recommended for New Designs
The HMC661LC4B is a SiGe monolithic, fully differential, single rank, track-and-hold (T/H) that provides unprecedented bandwidth and dynamic-range performance...
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HMC661 on Analog.com

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HMC661 IC , what is safety while Stuffing chip on  PCB. It gets damaged easily, whereas it is an expensive IC



		

			

									
					    MsKhalid
					
							

			
				
									
											
			
			
				
    
			
			
			    	
			                    
                
				                on Nov 28, 2022 
				
			
			
		
    

				
		
    
		    		    
		    
		    		      		            		        
    Category: Hardware
    
    		        		            		    
    Product Number:  HMC661 
    
    		        		    		    	
			
    I am taking care of ESD protection but IC gets damaged during soldering on PCB or reflow;  don't know what is the issue as it is  an expensive IC 
    
									
			        
		
    

				
						
        

    
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													+1
							
			
				
									
							        
			
			
			
      •  Analog Employees  
      
            
						
                            
            
            				
            
                on Nov 28, 2022 1:50 PM
            
            
					
      
	
      

		
		
      
					
      If the IC is damaged during soldering / reflow, it's possible that this is caused by moisture inside the device rapidly expanding due to the high temperature of the reflow machine.
      

      HMC661 is rated Moisture Sensitivity Level (MSL) 3, which means that the IC must be soldered or reflowed with 168 hours of opening the sealed bag. The ICs must be baked to remove moisture if the bag is open for more than 168 hours.
      

      The following link from Digikey, one of our distribution partners, contains more information on this: forum.digikey.com/.../3989
      
			
      

		
			
	      

		
		
	
      
	
      
		
      
			
		
      
	
      
	
      
		
						
						
						
						
				
				
		
		
      
			
		
      
	
      

      

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													+1
							
			
				
									
							        
			
			
			
      •  Analog Employees  
      
            
						
                            
            
            				
            
                on Nov 28, 2022 1:50 PM
            
            
					
      
	
      

		
		
      
					
      If the IC is damaged during soldering / reflow, it's possible that this is caused by moisture inside the device rapidly expanding due to the high temperature of the reflow machine.
      

      HMC661 is rated Moisture Sensitivity Level (MSL) 3, which means that the IC must be soldered or reflowed with 168 hours of opening the sealed bag. The ICs must be baked to remove moisture if the bag is open for more than 168 hours.
      

      The following link from Digikey, one of our distribution partners, contains more information on this: forum.digikey.com/.../3989
      
			
      

		
			
	      

		
		
	
      
	
      
		
      
			
		
      
	
      
	
      
		
						
						
						
						
				
				
		
		
      
			
		
      
	
      

      

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