I am taking care of ESD protection but IC gets damaged during soldering on PCB or reflow; don't know what is the issue as it is an expensive IC
HMC661
Recommended for New Designs
The HMC661LC4B is a SiGe monolithic, fully differential, single rank, track-and-hold (T/H) that provides unprecedented bandwidth and dynamic-range performance...
Datasheet
HMC661 on Analog.com
I am taking care of ESD protection but IC gets damaged during soldering on PCB or reflow; don't know what is the issue as it is an expensive IC
Hello MsKhalid,
Per page 10 of the HMC661 datasheet hmc661 (V03.0615) (analog.com), ESD protection level is 1B.
Regards,
Bill
If the IC is damaged during soldering / reflow, it's possible that this is caused by moisture inside the device rapidly expanding due to the high temperature of the reflow machine.
HMC661 is rated Moisture Sensitivity Level (MSL) 3, which means that the IC must be soldered or reflowed with 168 hours of opening the sealed bag. The ICs must be baked to remove moisture if the bag is open for more than 168 hours.
The following link from Digikey, one of our distribution partners, contains more information on this: forum.digikey.com/.../3989