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RF and Microwave

Q&A FAQ: HMC1126 Bond Pad Metallization and Passivation

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FAQ: HMC1126 Bond Pad Metallization and Passivation

earuiz

on Feb 9, 2022

Q: Can you share any information on the bond pad metallization and passivation for HMC1126?

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earuiz
Feb 9, 2022 +1 verified
A: The bond pad metallization is Au and the passivation layer is SiN for the HMC1126.

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+1 earuiz

on Feb 9, 2022 2:00 AM
A: The bond pad metallization is Au and the passivation layer is SiN for the HMC1126.
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+1 earuiz

on Feb 9, 2022 2:00 AM
A: The bond pad metallization is Au and the passivation layer is SiN for the HMC1126.
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