ADMV7310 footprint


Besides the distance (0.208'') there is another small difference between footprints in the datasheet and from BXL-file in the area of connection GND-pads:

 - in the DS - main polygon GND is connected to all GND-pads:

- from the BXL-file there are no connections:


Unfortunately, LGA-package is very difficult for installation and even small changes under the chip may cause significant changes for the installation line. 

Is the connection between GND-pads and main GND-polygon (51-59) on the layer, as is shown in the datasheet, necessary, or is it enough to place vias?

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