Could you tell me the red mark pad potential?
Are they as same as die bottom?
What is their purpose?
They don't really have any practical purpose for the end user. We sometimes touch probes down on them when we are characterizing the device.
These are all ground pads. They are connected by vias to the underside of the die. So you do not need to add any bond wires to them. Just make sure that the underside of the die is connected to ground.
Hi Enash san
Thank you for your reply.
I understand the non wore pad is connected the underside of the die.
Could you tell me what is the non wire pad purpose?
Thank you for reply.
I close this question.