HMC-AUH312 S-Parameter

Hi

I downloaded HMC-AUH312.s2p from ADI Web site.

The file mentions " RF probe launches were wirebonded to the RF die pads

and the measurements are referenced to those launches

(i.e., the launches and bond wires have not been de-embedded)".

I assume S-parameter was measured the chip on the substrate through the wire.

Could you give me S-parameter file without the substrate ,or both wire and the substrate?

Best regards

N.Kokubo

Parents
  • +1
    •  Analog Employees 
    on Mar 22, 2021 1:08 PM

    Unfortuntately, de-embedding to the launch is currently the best we can do. The launch is a small pad that we touch down on to using our probes. the pad on the launch is more rugged than the device pad and allows us to to multiple touch-downs (e.g. 50 to 100) compared to touching down directly on the pad which is something you might be only able to do once. The launch  is connected to the device pad using a very short bond wire. So what  you are getting is very close to a full de-embed. 

Reply
  • +1
    •  Analog Employees 
    on Mar 22, 2021 1:08 PM

    Unfortuntately, de-embedding to the launch is currently the best we can do. The launch is a small pad that we touch down on to using our probes. the pad on the launch is more rugged than the device pad and allows us to to multiple touch-downs (e.g. 50 to 100) compared to touching down directly on the pad which is something you might be only able to do once. The launch  is connected to the device pad using a very short bond wire. So what  you are getting is very close to a full de-embed. 

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