I downloaded HMC-AUH312.s2p from ADI Web site.
The file mentions " RF probe launches were wirebonded to the RF die pads
and the measurements are referenced to those launches
(i.e., the launches and bond wires have not been de-embedded)".
I assume S-parameter was measured the chip on the substrate through the wire.
Could you give me S-parameter file without the substrate ,or both wire and the substrate?