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HMC-AUH312 S-Parameter


I downloaded HMC-AUH312.s2p from ADI Web site.

The file mentions " RF probe launches were wirebonded to the RF die pads

and the measurements are referenced to those launches

(i.e., the launches and bond wires have not been de-embedded)".

I assume S-parameter was measured the chip on the substrate through the wire.

Could you give me S-parameter file without the substrate ,or both wire and the substrate?

Best regards