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LTC5508 junction to case thermal resistance

I'm looking for the junction-to-case thermal resistance of  LTC5508ESC6#PBF. Thanks-

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  • Hi SuzanneR,

    Sorry, we don't have that info readily available. Note, however, Pd = 6V max * 0.85mA max = 5.1mW is very small. The device could dissipate up to an additional 8mW driving a 2mA load. This makes total dissipation = 13mW max.

    Reference datasheet page 2, Theta jcn-ambient = 256 degC/W. Theta jcn-case will be less. But even with no other heat sinking (just soldered on a board), Temperature rise = 0.013W * 256 degC/W = 3.3 deg C, not a very large number.

    Hope that helps!  -Bruce H.

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  • Hi SuzanneR,

    Sorry, we don't have that info readily available. Note, however, Pd = 6V max * 0.85mA max = 5.1mW is very small. The device could dissipate up to an additional 8mW driving a 2mA load. This makes total dissipation = 13mW max.

    Reference datasheet page 2, Theta jcn-ambient = 256 degC/W. Theta jcn-case will be less. But even with no other heat sinking (just soldered on a board), Temperature rise = 0.013W * 256 degC/W = 3.3 deg C, not a very large number.

    Hope that helps!  -Bruce H.

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