I am conducting thermal analyses in Ansys Icepak on a board with some HMC6981LS6 amplifiers on it.
To properly model the amplifiers, I need to know the dimensions of the die, the die attach and the die pad, which I couldn't find on the datasheet.
As for the materials, the die should be made out of GaAs as I understand from the datasheet, but what is the material of the die attach and die pad (maybe copper for this last one)?
I hope it is possible to receive such information.
The information you are requesting is considered proprietary to Analog Devices and can't be provided. Thermal analysis of the HMC6981LS6 has been done and we provide theta JC, the thermal resistance from the channel to the ground paddle at the bottom of the package. For the HMC6981LS6, theta JC is 7.7 DegC/W. I have attached app note, AN-1604, Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages for further guidance.
Ok, I understand. Thanks for the reply.