HMC6981LS6 Die dimensions


I am conducting thermal analyses in Ansys Icepak on a board with some HMC6981LS6 amplifiers on it.

To properly model the amplifiers, I need to know the dimensions of the die, the die attach and the die pad, which I couldn't find on the datasheet.

As for the materials, the die should be made out of GaAs as I understand from the datasheet, but what is the material of the die attach and die pad (maybe copper for this last one)?

I hope it is possible to receive such information.

Thank you.

Best regards,

Alessandro D'Anniballe