I'm DFAE in Japan. We have a question from our customer who will start design the pcb. On the top picture we can see many via but on the bottom one we cannot see only copper foil instead of via. Could you please let me know the reason ?
For the ADMV1013-EVALZ we fill the vias with epoxy so we can plate over the vias and heatsink the bottom if needed to. If you are not planning on attaching a heatsink to the bottom then there shouldn't be any issues.