I'm DFAE in Japan. We have a question from our customer who will start design the pcb. On the top picture we can see many via but on the bottom one we cannot see only copper foil instead of via. Could you please let me know the reason ?
Please see the gerber files provided on the ADMV1013 product page. The fab notes say that the vias are filled with epoxy ground flush and plated over. Therefore its not possible to view them when looking at the board.
Thank you very much for your support. Sorry. I'd like to know why are the vias filled with epoxy ground flush and plated over. Is the thermal condition critical ?
Sorry for my pushing. Could you please let me know the reason ?
Hi Hiroyuki san,
There is a lot of literature online of conductive filled vias vs non conductive filled vias (epoxy) that describe the differences and give a thorough description of pcb via manufacturing techniques.
Here is some literature that I found that explains this:
In this case, if the vias are not filled with epoxy, will there be any problems with the device?
For the ADMV1013-EVALZ we fill the vias with epoxy so we can plate over the vias and heatsink the bottom if needed to. If you are not planning on attaching a heatsink to the bottom then there shouldn't be any issues.