HMC1110, admv7710-mounting and bonding questions

Hello! I have several questions on mounting and bonding of HMC1110/admv7710 :

1) HMC1110's datasheet makes reference to "HMC general Handling, Mounting, Bonding Note". Where can I find this note?

2) HMC1110 and admv7710 datasheets say 5 mil thick alumina thin film substrates are recommended. Can I use RO3003 laminate (5 mil thick)?

3) What are criteria to select epoxy for die attach? ADI recommends ABLEBOND 84-1LMIT and ATROX 800HT1V for some other mmwave components. But they are premixed epoxies with short "pot life time" at room temperature. It is not suitable for us, so I'm looking for two-part epoxy. Is it Ok to use EPO-TEK EK2000 (https://www.epotek.com/site/administrator/components/com_products/assets/files/Style_Uploads/EK2000.pdf) for HMC1110 and admv7710?

4) Assembly Diagrams in HMC1110 and admv7710's datasheets don't show GND wires. Should I connect low frequency GND pads (5, 7, 9, 11, 13, 15 17 ,19, 25, 27, 29, 31, 33, 35 ,37, 39 of admv7710 and #4, 6, 8, 10, 12, 17, 18 of HMC1110) to PCB GND polygon by wire bonding? Or conductive attachment of "Die Bottom" is sufficient?

5) Should I connect RF GND pads (# 1,3 20, 22 of admv7710 and #1, 3, 13, 15 of HMC1110) to PCB GND polygon by wire bonding? Or conductive attachment of "Die Bottom" is sufficient? If RF GND pads should be connected to GND by wire bonding, does it mean that coplanar waveguide transmission line is preferable to microstrip line?

6) Do eval boards for HMC1110 and admv7710 exist? Are there any future plans to create them?

Thanks!

Parents
  • Hi, 

    Based on the type of questions posted here I highly recommend that you pick up a copy of "Material and Processes for Hybrid Microelectronics" by Richard Brown (or something similar). I would also recommend "practicing" first with die that operate at a much lower frequency and get familiar with the processes, handling, die attach, bonding, etc. 

    1) HMC1110's datasheet makes reference to "HMC general Handling, Mounting, Bonding Note". Where can I find this note? I don't see it on the analog website. Will have to get back to you on this. 

    2) HMC1110 and admv7710 datasheets say 5 mil thick alumina thin film substrates are recommended. Can I use RO3003 laminate (5 mil thick)? No. 

    3) What are criteria to select epoxy for die attach? ADI recommends ABLEBOND 84-1LMIT and ATROX 800HT1V for some other mmwave components. But they are premixed epoxies with short "pot life time" at room temperature. It is not suitable for us, so I'm looking for two-part epoxy. Is it Ok to use EPO-TEK EK2000 Not sure; Tg is much lower (~80°C), CTE is better as is resistivity. Viscosity is quite low and this may will likely be problematic for E band.  (https://www.epotek.com/site/administrator/components/com_products/assets/files/Style_Uploads/EK2000.pdf) for HMC1110 and admv7710?

    Too many criteria to list, Tg, thermal conductivity, bond line, bond / shear strength, Cte match and the big one - one that allows the completed assembly to pass a thorough package qualification!

    4) Assembly Diagrams in HMC1110 and admv7710's datasheets don't show GND wires. Should I connect low frequency GND pads (5, 7, 9, 11, 13, 15 17 ,19, 25, 27, 29, 31, 33, 35 ,37, 39 of admv7710 and #4, 6, 8, 10, 12, 17, 18 of HMC1110) to PCB GND polygon by wire bonding? Or conductive attachment of "Die Bottom" is sufficient? Refer to the assembly diagram on page 6 of the HMC1110 datasheet, at E band wire bonds aren't used. 

    5) Should I connect RF GND pads (# 1,3 20, 22 of admv7710 and #1, 3, 13, 15 of HMC1110) to PCB GND polygon by wire bonding? Or conductive attachment of "Die Bottom" is sufficient? If RF GND pads should be connected to GND by wire bonding, does it mean that coplanar waveguide transmission line is preferable to microstrip line? I would use coplanar waveguide.

    6) Do eval boards for HMC1110 and admv7710 exist? Are there any future plans to create them? No plans to create eval boards for E band. You can contact XMicrowave as they provide a connectorized module for the HMC1105 which is similar, perhaps they can connectorize the HMC1110.  

    Best Regards, 

    Marty 

Reply
  • Hi, 

    Based on the type of questions posted here I highly recommend that you pick up a copy of "Material and Processes for Hybrid Microelectronics" by Richard Brown (or something similar). I would also recommend "practicing" first with die that operate at a much lower frequency and get familiar with the processes, handling, die attach, bonding, etc. 

    1) HMC1110's datasheet makes reference to "HMC general Handling, Mounting, Bonding Note". Where can I find this note? I don't see it on the analog website. Will have to get back to you on this. 

    2) HMC1110 and admv7710 datasheets say 5 mil thick alumina thin film substrates are recommended. Can I use RO3003 laminate (5 mil thick)? No. 

    3) What are criteria to select epoxy for die attach? ADI recommends ABLEBOND 84-1LMIT and ATROX 800HT1V for some other mmwave components. But they are premixed epoxies with short "pot life time" at room temperature. It is not suitable for us, so I'm looking for two-part epoxy. Is it Ok to use EPO-TEK EK2000 Not sure; Tg is much lower (~80°C), CTE is better as is resistivity. Viscosity is quite low and this may will likely be problematic for E band.  (https://www.epotek.com/site/administrator/components/com_products/assets/files/Style_Uploads/EK2000.pdf) for HMC1110 and admv7710?

    Too many criteria to list, Tg, thermal conductivity, bond line, bond / shear strength, Cte match and the big one - one that allows the completed assembly to pass a thorough package qualification!

    4) Assembly Diagrams in HMC1110 and admv7710's datasheets don't show GND wires. Should I connect low frequency GND pads (5, 7, 9, 11, 13, 15 17 ,19, 25, 27, 29, 31, 33, 35 ,37, 39 of admv7710 and #4, 6, 8, 10, 12, 17, 18 of HMC1110) to PCB GND polygon by wire bonding? Or conductive attachment of "Die Bottom" is sufficient? Refer to the assembly diagram on page 6 of the HMC1110 datasheet, at E band wire bonds aren't used. 

    5) Should I connect RF GND pads (# 1,3 20, 22 of admv7710 and #1, 3, 13, 15 of HMC1110) to PCB GND polygon by wire bonding? Or conductive attachment of "Die Bottom" is sufficient? If RF GND pads should be connected to GND by wire bonding, does it mean that coplanar waveguide transmission line is preferable to microstrip line? I would use coplanar waveguide.

    6) Do eval boards for HMC1110 and admv7710 exist? Are there any future plans to create them? No plans to create eval boards for E band. You can contact XMicrowave as they provide a connectorized module for the HMC1105 which is similar, perhaps they can connectorize the HMC1110.  

    Best Regards, 

    Marty 

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