During my assembly process I am damaging the HMC590LP5 by creating shorts to ground on the RF input and output.
I’m trying to solder the HMC590LP5 to a .010” thick RO4350 PCB and solder the PCB to a heat sink carrier using SN63PB379 (melting point of 183C.)
In my assembly process I pre-tin the carrier with SN63PB37. Place the carrier and PCB on a hot plate. Bring the hot plate up to ~183C to reflow the solder. Pre-tin the pads for the HMC590. Place the HMC590 on the PCB and immediately remove the assembly from the hot plate. During the process the carrier temperature never exceeds 185C.
The data sheet indicates the parts can handle a maximum reflow temperature of 260C. What is the maximum duration the part can be at 260C?
What solder and process is used to assemble the HMC590LP5 Evaluation board where there are 2 plates attached to the bottom of the PCB assembly?
Is it possible that I have a defective batch?
I have lost at least 5 parts and need a solution.
Hi,I moved your query to its proper community RF and Microwave.Best Regards,Goz
When do expect to have an answer? I'm desperate to solve this problem.
I suggest you contact ADI support directly at:
I Have multiple times by phone and email.
Here is a reflow profile below for HMC590LP5 from app note AN772 that you can follow when mounting it on a PCB
The app note can be found here:
I am awaiting for detailed assembly instruction from our assembly and will share the information as soon as possible.