Apart from pre-warming this part at 125 degrees for 24 hours to remove any moisture does anyone have any recommendations to solder this chip onto a board ?
I have allowed a 3 mm plated through hole to allow soldering onto the E-pad but the amount of copper available to solder the pads using a mini flow tip is limited. Should I use solder paste because that may risk shorting beneath the component ?
The case conforms to a JEDEC MO-220WHHD
regards
david
David,
we typically try to put some solder on the pad and use flux to keep the IC in place while heating it with a hot air heat gun.
Attached is a quick write up on it we typically send out with our ADIsimPower Blank boards.
LucaV
LucaV wrote: David, we typically try to put some solder on the pad and use flux to keep the IC in place while heating it with a hot air heat gun. Attached is a quick write up on it we typically send out with our ADIsimPower Blank boards. LucaV
LucaV wrote:
Hello Luca
Thanks for the doc. Are the via's in the ground pad connected to the ground plane through direct connection or by thermal relief ?
I have found a few good videos on soldering QFN's.
http://www.youtube.com/topic/hQW0dV3s3K8/quad-flat-no-leads-package?feature=relchannel
This FAQ was generated from the following discussion: Tips for soldering a ADP2323 for a prototype
there is a video I posted in the FAQ section on this subject as well
Hand soldering a 12 pin LFCSP
There is a good video at http://www.youtube.com/watch?v=c_Qt5CtUlqY showing a technique that can be used by applying solder to the pads and reflowing with a hot air gun and board heater. It works well with a bit of practice. The alternative is to use solder paste and a micro stencil for the package type.