Please provide junction to board , junction to case and junction to ambient
temperatures of ADM709
For the ADM709RAR (SOIC-8 package) the junction to ambient thermal impedance is
110 degC/Watt. I don’t believe we have figures for the other impedances
available. From what I know, ADI does not usually quote the θjc value for our
plastic packages because the case temperature is non-uniform, and therefore the
point of measurement can influence the temperature result, leading to incorrect
calculation of the junction temperature.