Are there any specific layout guidelines for the MAX15301 in a high current application?

First, we recommend including two 5mm x 6mm (power SO8) low-side MOSFETs.

Another, important element of the layout is to keep the main current loops small and superimposed (overlapping)

1. High-side on-time loop from VIN caps, through the switches and inductor to output cap, back to VIN cap ground
2. Low-side on-time loop from rectifier GND, through the low-side switch and inductor to output cap, back to ground
3. High-side gate drive from boost cap to IC to high-side switch, back to LX node (boost cap flying ground)
4. Low-side gate drive from bypass cap to IC to switch back to ground

For high current, the pours for VIN and VOUT must be substantial, and hopefully uninterrupted on the top (or component) layer of the PCB, supplemented with internal polygons and split-planes wherever possible, and with use of stitching vias.

 Also, keep the LX node small and direct to minimize losses and EMI radiation.