The PCB layout plays an important role in the improvement of the MAX17504 heat dissipation and efficiency. Under normal conditions, a 4-layer PCB dissipates heat better than a 2-layer PCB, and a PCB with 2oz copper thickness dissipates heat better than one with a 1oz thickness. In addition, the MAX17504 exposed pad needs to be connected to a large copper plane. The following guideline from MAX14691 datasheet (Rev 2; 5/15) can be applied for connecting the exposed pad:
"Install the IC on an exposed pad landing of minimum 100 x 100 mils, with at least five through vias to the GND plane. The vias should be 32mils in diameter, with a 16mils plated hole. The hole plating needs to be at least 0.5oz copper.
Provide a minimum of 1in x 1in area of copper plane on all four layers. It is important to remember that the inner planes do not contribute much to heat dissipation, due to FR4 isolation, but are important from an electrical point of view.
If possible, keep the top and bottom copper areas clear of solder mask, as this will greatly improve heat dissipation"