Power Management

Q&A What are the components of the solder used inside the device? What is the melting point?

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SLA Status	Assignee	Support Status
SLA Closed. Met after 24 hours		Open

Products Mentioned

LTM4632 Recommended for New Designs
The LTM4632 is an ultrathin triple output step-down Î¼ModuleÂ® (power module) regulator to provide complete power solution for DDR-QDR4 SRAM. Operating...
Datasheet
LTM4632 on Analog.com

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What are the components of the solder used inside the device? What is the melting point?

LarryLiU on Mar 2, 2026

Thread Summary

The user inquired about the solder components and melting point used in the device. The final answer directed the user to refer to the 'Assembly Considerations for Analog Devices µModule LGA & BGA Packages' document for detailed information. No specific solder components or melting points were provided in the thread.
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Category: Hardware

Product Number: LTM4632IV#3KVPBF, LTM4632

What are the components of the solder used inside the device? What is the melting point?

hardware LTM4632 DDR/QDR Memory Bus Termination solder used inside the device switching regulators LTM4632IV#3KVPBF Show More

lauren

on Mar 3, 2026 1:43 AM
+1
Please refer to the bellow file:Assembly Considerations for Analog Devices µModule LGA & BGA Packages
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