Dear ADI Support Team,
I’m using the LT3045 in a new design and I’m preparing a thermal simulation model. I noticed the datasheet lists θJA and θJC, but I couldn’t find θJB (Junction-to-Board).
Could you please provide the LT3045 θJB value ? or any recommended thermal model/approach for estimating Tj from board temperature?
For reference, I’m primarily interested in the package(s) below:
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[DD] 3mm × 3mm DFN (preferred)
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[MSE] MSOP-12 (if different)
Thank you in advance for your help.
Best regards,
Klex

