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LT3045 Thermal

Category: Datasheet/Specs
Product Number: LT3045

Dear ADI Support Team,

I’m using the LT3045 in a new design and I’m preparing a thermal simulation model. I noticed the datasheet lists θJA and θJC, but I couldn’t find θJB (Junction-to-Board).

Could you please provide the LT3045 θJB value ? or any recommended thermal model/approach for estimating Tj from board temperature?

For reference, I’m primarily interested in the package(s) below:

  • [DD] 3mm × 3mm DFN (preferred)

  • [MSE] MSOP-12 (if different)

Thank you in advance for your help.

Best regards,
Klex

  • ADI North America will be on winter shutdown starting December 24, 2024; perhaps another community member can assist you until our return on January 2, 2025.
  • Hi,
    Thanks for contacting Analog Devices!
    We provide info of Junction to ambient and junction to case thermal resistance only. Junction to board Thermal resistance is different for different boards. So, this info is not mentioned in datasheet.
    Generalised thermal data for LT/AD parts.
    Sometime Junction to board Thermal resistance is not mentioned in datasheet. So, Please use thermal resistance table for ADI and LTC parts shown below.
    We provide soldering temp info for some IC's.
    All ADI IC follows JEDEC standard.  If soldering temp info is not available in datasheet, then Please follow JEDEC.org for more detail.
    ADI only provides LTspice model. You can do thermal calculation for max junction temperature calculation.
    Regards,
    Tech Support