Category: Hardware
Product Number: MAX5024
We are working on a project that requires pure-tin finish components be solder dipped. This part, the MAX5024L, has a heat sink on the back and I do not think it's possible to apply a eutectic solder to the back without damaging the plastic encapsulant and die surface.
What is the material that makes up the heat sink? Is there a problem with tin-whisker growth? Is there a process for eutectic solder application or is it not recommended to attempt a solder?
