Category: Datasheet/Specs
Product Number: LT3033
Hi
I refer to www.analog.com/.../LT3033.pdf
On page 18, under Applications Information, it states 'The underside of the LT3033 UDC package has exposed metal from the lead frame to the die attachment.' Could I check if this is referring to Pins 21, 22, 23 and 24?
If so, could I confirm that the Theta_JC value of 3.4degC/W is referring to the thermal resistance between junciton-to-case (bottom)? The value seems quite small for the footprint of Pins 21 - 24.
Thank you
