Hi Sir,
If increase PCB soldered to 5000mm2 and four-layers 2oz, the DFN package's thermal resistance will approximately how much °C/W?
Thanks.
Please take this with grain of salt. Best is still to run simulation as to how much reduction is achieved by doubling the copper area.Below is copper size change of ADP7118 LDO as seen in datasheet. Thermal resistance of LFCSP is reduced by ~10C/W from 500 to 1000mm copper area.
Please take this with grain of salt. Best is still to run simulation as to how much reduction is achieved by doubling the copper area.Below is copper size change of ADP7118 LDO as seen in datasheet. Thermal resistance of LFCSP is reduced by ~10C/W from 500 to 1000mm copper area.
