Please let me know the following about ADP1706ARDZ-1.2-R7.
1) Recommended dimension of thermal via on exposed pad.2) Recommended dimension of stencil.
Moved to the Power forum where someone should be able to better help
Apologies for the delay.
1. For thermal vias, we recommend using JESD51-5 (under Section 4) guide which is having 0.3mm diameter. You could have 4 vias for this part's EPAD.
2. You can refer to the image below for dimensions: