Tips for soldering a ADP2323 for a prototype

Apart from pre-warming this part at 125 degrees for 24 hours  to remove any moisture does anyone have any recommendations to solder this chip onto a board ?

I have allowed a 3 mm plated through hole to allow soldering onto the E-pad but the amount of copper available to solder the pads using a mini flow tip is limited. Should I use solder paste because that may risk shorting beneath the component ?

The case conforms to a JEDEC  MO-220WHHD