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ADSP-2148x E-pad question

Hello

I have just finished reading the EE- 352 Engineering note regarding E-pad packages and mounting techniques. One thing I am not clear of is you don't say whether or not you use thermal relief's or direct connects on the ground plane connecting via's. Obviously direct connection would give you better electrical connection and lower thermal resistance to the ground plane but would it alter the temperature profile needed for reflow ? ie which would be better from the point of view of manufacturability ?

regards

david

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  • I always use many multiple direct connects. You want the impedance to be very low.

    On some boards, I also use a large center hole as well. This makes prototyping and rework easier in cases where you are not going to have an automated reflow. The stencil will apply paste in four quadrants, so that it doesn't go into the center hole.

    If the profile is set up correctly, you will not have a soldering issue.

    BTW, The same issue applies to many buck regulators used for the core supply - No reliefs.

    Al Clark

    www.danvillesignal.com

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  • I always use many multiple direct connects. You want the impedance to be very low.

    On some boards, I also use a large center hole as well. This makes prototyping and rework easier in cases where you are not going to have an automated reflow. The stencil will apply paste in four quadrants, so that it doesn't go into the center hole.

    If the profile is set up correctly, you will not have a soldering issue.

    BTW, The same issue applies to many buck regulators used for the core supply - No reliefs.

    Al Clark

    www.danvillesignal.com

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