About ADP170/1 thermal consideration

Question

Hi, 
 I have a question about thermal consideration on ADP171 datasheet. 
 http://www.analog.com/static/imported-files/data_sheets/ADP170_171.pdf 
 According to Table 6, there is θja for each copper size. 
 Does this GND copper area means the surface layer or it's also including other layer such as 2nd(whole GND)layer? 
 For ADP170 evaluation board, what are the GND copper size and θja will be? 
 Best, 
 Tarzan

ADIApproved · Accepted Answer

Tarzan, 
 The vias actually do help reduce the thermal resistance significantly. It’s best to place a couple vias as close to the part as possible for best effect. The vias don’t have to be in the ground plane, they can be on the power planes as well. The point is that you want to thermally connect the copper on both sides of the board 
 Best Regards, 
 Glenn Morita)

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About ADP170/1 thermal consideration