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ADP5585 going BAD after few days usage.ESD ISSUES?

We are using ADP5585 in our design for interfacing to a keyboard. The schematics is as shown in the attachment. The lines KBC0,1,2,3 and KBR0,1,2,3 are going to a 4 X 4 matrix KEYPAD connected with about 15 inches long ribbon cable.

The capacitors C2,C4,C6,C8, C67,C68,C69,C74 though are shown in schematics are not really mounted on board.

The device TPD8F0003DQDR is being used as ESD protection device Its link is http://www.ti.com/lit/ds/symlink/tpd6f003.pdf

we are noticing that in spite of using above ESD protection device we are seeing failures of the ADP5585 device. The failed devices basically have less than 50 ohm resistance between any of the I/O pins and GND. Incidentally we are seeing that even the lines which are not connected to KEYPAD like pin numbers 16, 10 and 1 which are connected to internal signals also develop this low resistance between that specific pin and GND.

Also these failures Occur only after a few days of usage typically 5-10 days with KEYPAD being used about 10-15 times per days

Following questions

1. Has anyone else or even Analog devices have seen these kind of failures happening with ADP5585

2. Is there any other issues in the schematics attached ?

3. Is there really a ESD issue or is it for any other reason that the ADP5585 device may be going bad ?

4. Should we use any other ESD protection device than the currently used ? probably the clamping voltage of the device we are using is little bit higher than the transient tolerance limit of ADP5585

Parents
  • Thanks RSchnell for your reply. Below replies from my side to your questions

    1. Regarding - Whether the part operate correctly next time it is powered up - Yes , 2-3 times when the KEYPAD stopped working we powered OFF the board and checked for short between any of the ROW/COL lines to GND we did see about 120 ohm or 30-40 ohms to GND. After leaving the board OFF for same time when the board was powered ON again, KEYPAD continued to operate normally. However after still more continued usage of the board the ROW/COL lines developed a permanent short to Ground.

    2. Regarding Voltage  from CPU - yes it 3.3V.

    3. Regarding KP_12V_OFF - It is connected to gate of another FET which is again driven only from 3.3V level signals and not any higher. As well since there is a zero ohm in the path of that signal we have isolated that signal and we have seen the problem occur even under that situation as well

    4. Regarding the capacitors - yes our plan is to keep them un mounted itself.

    5. Regarding chasis_GND and IC ground - They become same once the system is mounted inside the metallic enclosure we have the chasis_GND gets shorted to IC ground , however yes there is a possibility that in our initial units when the testing was being done chasis_GND might be a floating node. Do you think if this Node was floating it could have caused the malfunction of IC as reported above.

    6. Regarding voltage spikes getting coupled to ROW and COL pins - I do not see that possibility in the way in our system because the only other cable that is close proximity to the KEYPAD cable is LCD DISPLAY cable and a USB cable  which have voltages in the region of 5V

    Further questions from my side

    A. What is the transient voltage limit on the ADP5585 pins because the external ESD protectors we are using may have clamping voltages in the region of 10-15V for few ns. You can look at the datasheet of ESD protector from TI that we used - web link for same was provided above. We are also planning to change the ESD protector to that from NXP since it has even higher series resistor of 200 ohm and a higher capacitance of 15pF (compared to 100 ohm series resistor and 8.5pF capacitance in TI part). The selected NXP P/N is IP4253CZ16-8-TTL.

    B. Do you recommend any other specific ESD protector to be used ?

    B. Do you think if chasis_GND was floating then ,  it could have caused the malfunction of IC as reported above?

Reply
  • Thanks RSchnell for your reply. Below replies from my side to your questions

    1. Regarding - Whether the part operate correctly next time it is powered up - Yes , 2-3 times when the KEYPAD stopped working we powered OFF the board and checked for short between any of the ROW/COL lines to GND we did see about 120 ohm or 30-40 ohms to GND. After leaving the board OFF for same time when the board was powered ON again, KEYPAD continued to operate normally. However after still more continued usage of the board the ROW/COL lines developed a permanent short to Ground.

    2. Regarding Voltage  from CPU - yes it 3.3V.

    3. Regarding KP_12V_OFF - It is connected to gate of another FET which is again driven only from 3.3V level signals and not any higher. As well since there is a zero ohm in the path of that signal we have isolated that signal and we have seen the problem occur even under that situation as well

    4. Regarding the capacitors - yes our plan is to keep them un mounted itself.

    5. Regarding chasis_GND and IC ground - They become same once the system is mounted inside the metallic enclosure we have the chasis_GND gets shorted to IC ground , however yes there is a possibility that in our initial units when the testing was being done chasis_GND might be a floating node. Do you think if this Node was floating it could have caused the malfunction of IC as reported above.

    6. Regarding voltage spikes getting coupled to ROW and COL pins - I do not see that possibility in the way in our system because the only other cable that is close proximity to the KEYPAD cable is LCD DISPLAY cable and a USB cable  which have voltages in the region of 5V

    Further questions from my side

    A. What is the transient voltage limit on the ADP5585 pins because the external ESD protectors we are using may have clamping voltages in the region of 10-15V for few ns. You can look at the datasheet of ESD protector from TI that we used - web link for same was provided above. We are also planning to change the ESD protector to that from NXP since it has even higher series resistor of 200 ohm and a higher capacitance of 15pF (compared to 100 ohm series resistor and 8.5pF capacitance in TI part). The selected NXP P/N is IP4253CZ16-8-TTL.

    B. Do you recommend any other specific ESD protector to be used ?

    B. Do you think if chasis_GND was floating then ,  it could have caused the malfunction of IC as reported above?

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