Hi to all,
on ADM7154 datasheet it's reported thermal resistance for SOIC-8 package (junction-to-ambient) as 36,9 °C/W "in worst case".
What does "worst case" exactly mean?
Reading datasheet (Thermal data) I understand thermal resistance has been measured with 4-layer PCB with soldered exposed pad.
Vin = 5.0V, Vout = 3.3V, Imax = 0.2A -> Pd= 340mW on 2 layer PCB.
Can I use SOIC-8 without soldered exposed pad? What would be thermal resistance in this condition?
Taking a look to other LDO on same package (but without exposed ground pad), highest thermal resistance I've found is 69 °C/W (LT1129); can I get this thermal resistance as reference value for not soldered exposed pad?
[edited by: Killertechno at 10:34 AM (GMT 0) on 30 Oct 2019]