LTC3853EUJ#TRPBF

Where can I find a recommendation for the number of vias in the PGND solder pad?

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  • I have one more follow-on question for the LTC3853EUJ#TRPBF item about the solder pad:

    What is the PD (power dissipation for this device when it runs from INTVCC?  This question is based on the following text from the 3853fc.pdf, page 20, 1st Column, 2d para. "Power dissipation for the IC in this case is highest and is equal to VIN • IINTVCC....  For example, the LTC3853
    INTVCC current is limited to less than 50mA from a 24V supply in the UJ package and not using the EXTVCC supply..."

    My question can further resolved/clarified if the responder to the question can simply indicate where in the 3853fc.pdf the 50mA, 24V Supply limitation is specified.  

Reply
  • I have one more follow-on question for the LTC3853EUJ#TRPBF item about the solder pad:

    What is the PD (power dissipation for this device when it runs from INTVCC?  This question is based on the following text from the 3853fc.pdf, page 20, 1st Column, 2d para. "Power dissipation for the IC in this case is highest and is equal to VIN • IINTVCC....  For example, the LTC3853
    INTVCC current is limited to less than 50mA from a 24V supply in the UJ package and not using the EXTVCC supply..."

    My question can further resolved/clarified if the responder to the question can simply indicate where in the 3853fc.pdf the 50mA, 24V Supply limitation is specified.  

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