Hello.
I have a question about the through-holes in the EPAD section under the IC on the TMC2240 evaluation board.
Are you taking measures to prevent solder from flowing?
Specifically, do you intentionally add a via cover that fills the through-holes with resist?
Which of the following specifications (1-3) is the type of via cover?
1. The via is covered with a film of solder resist. 2.
2. The via is partially closed by a non-conductive medium (epoxy resin) and solder resist.
3. The via is completely filled with a non-conductive material.
Best regards,