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I have a question about the through-holes in the EPAD section under the IC on the TMC2240 evaluation board.

Category: Datasheet/Specs
Product Number: TMC2240

Hello.

I have a question about the through-holes in the EPAD section under the IC on the TMC2240 evaluation board.

Are you taking measures to prevent solder from flowing?

Specifically, do you intentionally add a via cover that fills the through-holes with resist?

Which of the following specifications (1-3) is the type of via cover?

1. The via is covered with a film of solder resist. 2.
2. The via is partially closed by a non-conductive medium (epoxy resin) and solder resist.
3. The via is completely filled with a non-conductive material.

Best regards,