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temperature profile for the reflow soldering of the ADUCM350

Thread Summary

The user is seeking the correct soldering temperature for the ADUCM350 chip on a custom PCB. The maximum operating temperature is not the reflow temperature; a reflow temperature of around 250°C is recommended. The final answer suggests that issues with the board's functionality might be due to soldermask alignment, and recommends posting a closeup photo of the BGA footprint for further analysis. The JEDEC J-STD-020E standard should be followed for the reflow profile.
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Hello everyone,
I have to solder some components, including the ADUCM350 chip, on a new small PCB developed by the evalutation one.
I have checked the chip datasheet about the soldering temperature, but nothing. In attached, the only thing I found.

I know that the soldering max temperature depends both from the solder paste than, espacially, the component most vulnerable, thermally talking. I would like to know if the operating max temperature is just the reflow temperature, If that is not the case, as I think, what is it?

Thank you for your time =)

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