Q:
Do you have any recommendations for using under-fill to strengthen the attachment of the ADIS16475 to a printed circuit board?
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A:
Yes, we can offer some suggestions, for a process that we have used in the past. The intent of this document to offer our customers with a starting point, for developing a process that is able to support all qualification and application level environments.
Acknowledgement to Ed Bradshaw and Tom Richards, for organizing and documenting this process, so that we could share it with this community.