we have a program in which there is an ADIS16209 as the mail tilt sensor.
we have tested several units via the evaluation board and they performed to spec.
we had made a PCB design which includes the ADIS16209 on-board (according to app notes and the datasheet rev-c).
in this architecture the ADIS is getting stable and filtered 3.3V from a switched DC/DC converter (ripple is lower than 15mV)
we had made 10 assemblies via automated SMT. from the 10 units only 3 ADIS units were functional!!
we had x-ray tests to see the solder on the pads and the solders were looking good but the units were none functional.
we had opened a new and seals batch of components and made another 7 SMT units built (taking the soldering profile, SMT aliment etc' under great care).
in this batch we had all 7 working but not according to spec or expectations...
we configure the SMPL_PRD to 41 and the AVG_CNT to 8 (the max value) and our testing facility's temperature is 23C-25C:
here are some questions:
we had gone through all calculations, checked and rechecked the SPI interface and we are currently in a very problematic situation - we have some 100 units which we are not assembling because we don't know why the first 10 are not operating according to expectations....
waiting for any help possible!!!
Can I have a copy of the answer. I am facing similar issues with multiple units.