Hi team,
I am currently working on a board utilizing the MAX86916 integrated optical sensor. After the assembly and soldering process, I noticed that some soldering flux has somehow seeped into the sensor module and is now trapped underneath the protective glass, obscuring the optical area.
I am aware that the glass is sealed, and I have not attempted to pry it open as I know it might damage the delicate wire bonds and the internal optical barrier.
My questions are:
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Is there any recommended, non-destructive method to clean or extract flux from inside the sealed optical cavity of the MAX86916?
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Does this flux ingress permanently compromise the sensor's optical isolation and factory calibration, effectively rendering the module unusable?
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For future board assemblies, what are the strict assembly and soldering guidelines (e.g., specific no-clean flux, temperature profiles, or masking tape) to prevent flux from penetrating the glass seal of this specific component?
Any insights or recommendations would be highly appreciated. Thank you!