Post Go back to editing

What material are the leads made of on the ADXRS645

Thread Summary

The user encountered grainy and poor solder joints on the ADXRS645 after exposure to 175°C for 20 hours. The leads are Ni/Au-plated ceramic-compatible alloy. ADI recommends higher-melting alloys like Au80/Sn20 for long-term stability at elevated temperatures. The EVAL-ADXRS645Z evaluation board uses standard SnPb or SAC solder, not qualified for continuous high-temperature operation.
AI Generated Content
Category: Hardware
Product Number: ADXRS645

I would like to know what material the leads are made of on the ADXRS645. I believe I am encountering some incompatibility with the solder that I am using. When the part is initially soldered, the solder joints look good, but after exposing the solder to 175C for about 20 hours the solder joints look very grainy and poor. I need to know the material that the leads are made of and whether Analog Devices recommends a specific solder to use for those leads? Or what is the solder used on the ADXRS645 evaluation board?

  • Here is a photo of what the leads look like after exposure to 175C for about 20 hours.

  • The ADXRS645 is packaged in a 15-lead brazed-lead ceramic package (DY-15-1). The leads are based on a ceramic-compatible alloy and have a nickel barrier with gold plating (Ni/Au). This finish is designed to be compatible with standard industry solders.

    ADI does not specify a single required solder alloy for this device. For typical industrial environments up to around 125 °C, Sn63/Pb37 or SAC305 solders are commonly used with good results on Ni/Au-finished leads. In applications where the assembly will be exposed to higher temperatures for extended periods, such as the 175 °C condition you described, these standard solders can develop a dull or grainy appearance over time due to microstructural changes. In such cases, higher-melting alloys provide better long-term stability. Alloys such as Au80/Sn20 are often selected in designs that must operate reliably for long durations at elevated temperature.

    With respect to the evaluation board (EVAL-ADXRS645Z), it is assembled through standard PCB manufacturing processes. The exact solder alloy used is not specified in the documentation, but it is typically SnPb or SAC. These boards are intended for functional evaluation and are not qualified for continuous high-temperature operation.