What 's the reason for specifying the reflow temperature value for the through hole part, MAX233CPP+G36? Isn't reflow process specific to, and limited to surface mount devices?
Answer:The list of products tagged with suffix “G36” suffix, consists of surface mount and through hole (PDIP) packages. “MAX233CPP + G36”, customers must control their wave soldering (vs Reflow) temperature to max +225°C.
So, although you will not reflow the MAX233CPP+G36 device, the normal wave soldering temperature must be limited to a maximum of +225°C due to the fact that this is a module with capacitors stuffed into the package, along with the device itself. The fact that this is a module explains why it is not wave soldered at the same temp as a monolithic device - the capacitors inside must be considered, in addition to the Maxim die.