Please see the thermal parameters below, the Tjmax is 125C. When the junction temperature reaches 125C, the thermal shutdown feature will disable the driver and receiver output to decrease the power dissipation on the device. So the IC could be back to normal working condition when junction temperature drops to some degree.
For driver over-current protection function, you could refer to the "Driver Overvoltage and Overcurrent Protection" section, the protection function limits the power dissipation on the IC. The thermal shutdown function would shutdown the IC rather than the over current protection feature. But the over current condition could cause the junction temperature going high and then trigger the shutdown.
You could calculate the maximum current based on the equation below:
T_junction = T_ambient + theta_JA*power_dissipation, for BGA package, the maximum power dissipated in the package could be (125-25)/32.2 = 3.11W when ambient temperature is 25C.