The ADSP-BF537 is fabricated on the 0.13µm CMOS process. Reliability data for
this wafer fab process is available on our external website at:
ent/index.html . Based on the relevant reliability data for this process, the
MTTF for devices built on this fab process is 293.9 million hours and FIT rate
is 3 (both correlated to 55°C, 60% C.L.).