Regarding the reflow temperature profile, the users should refer to the JEDEC J-STD-020 document for the reflow profile guidelines (attached). The actual profile is specific to the custom board design and should be adjusted as appropriate to each design.
ADI does provide the peak reflow temperature information (along with other package related information) for most part numbers on www.analog.com. Specifically: https://www.analog.com/en/design-center/packaging-quality-symbols-footprints/package-resources/keypackageinformation.html
Please contact ADI if the specific part number is not listed or if the information is incomplete.
