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ADSP-21160N Production
The ADSP-21160N SHARC® DSP is the second iteration of the ADSP-21160. Built in a 0.18 micron CMOS process, it offers higher performance and lower power...
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ADSP-21160N on Analog.com

Solder Temp Profile

Military

on Jul 22, 2024

Category: Datasheet/Specs

Product Number: ADSP-21160NCBZ-100, ADSP-21160N

Hello,

We are using the Analog Dev ADSP-21160NCBZ-100 DSP on CCA, along with SnPb finished Xilinx FPGA BGA & TQFP devices.

The Xilinx devices have a MAX Reflow Temp of 225C. I understand that the ADSP-21160NCBZ-100 has a MAX Reflow Temp of 260C.

1. Is a Solder Profile Temp of 217C to 225C sufficient to solder the ADSP-21160NCBZ-100 DSP to the CCA?

2. What is the minimum Solder Profile Temp to adequately solder ADSP-21160NCBZ-100 DSP to the CCA?

Thank You for your assistance,

Larry Baricevic, Tucson, AZ

0 Ranji

1 month ago
Hi,

Regarding "Is a Solder Profile Temp of 217C to 225C sufficient to solder the ADSP-21160NCBZ-100 DSP to the CCA?"
>> Yes, the soldering can be done at temperature 217 degrees Celsius. Please refer the "Table 8: Reflow profile"(Page No: 29/51) available in the Assembly Considerations file. Please find the link given below.
https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf

Regarding "What is the minimum Solder Profile Temp to adequately solder ADSP-21160NCBZ-100 DSP to the CCA?"
>> As per the "Table 8: Reflow profile"(Page No: 29/51), For pre-heat the minimum soak temperature for lead-leaded solder is 100 °C, while for lead-free solder, it is 150 °C.

Hope this helps. Please let us know if you need further assistance on this.

Regards,
Ranjitha.R
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