TS101 Programming Issue

We have TS101 based DSP board. EMU, TCK, TDI & TMS signals are pulled up by 4.75K resistor to 3.3V DSP line.

When trying to program the DSP with HPUSB-ICE emulator, I got error " An EMUIR scan was attempted ,but the dsp is not ready to accept instruction via JTAG ". In Visual DSP configurator, with the "Test" option JTAG scan is passing for all the parameters are passing. What could be problem in programming?

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  • Hi

    Thanks for detailed analysis. I tried all the solutions suggested but without much luck.

    The problem was finally traced to "Contact issue" of BGA balls with PCB pads.

    I request some more help in this regard:

    As I memtioned in query, the four pull up resistors connected across EMU~, TCK, TDI & TMS has value of 4.75K, but when the ICE scan test passes these resistors measure 3.7K to 3.9K. This is one way for me to ensure, that at these locations, BGA balls are making contact with PCB pads. But what are other vital signals coming out of DSP (that must be present for establishing "Target Connection") which can be monitored on DMM / Scope to ensure that the BGA is indeed making contact with pads ?

    As referred in Analog Devices website, we are following "IPC/JEDEC J-STD-020D.1" for mounting of BGA. As per this standard, the Peak package body temperature (Tp) for Pb-Free devices is 260 deg. But we needed to raise the temperature to almost 300 Deg for this BGA to work (that too after re-flowing it couple of times). We are using top & bottom heat blower for re-flow assembly. Which specific re-flow profile would you recommend for this mounting this BGA? Is there a resource where I can get some more help about correct temperature re-flow profile of ADSP TS101 ?

     

    Regards

     

     

Reply
  • Hi

    Thanks for detailed analysis. I tried all the solutions suggested but without much luck.

    The problem was finally traced to "Contact issue" of BGA balls with PCB pads.

    I request some more help in this regard:

    As I memtioned in query, the four pull up resistors connected across EMU~, TCK, TDI & TMS has value of 4.75K, but when the ICE scan test passes these resistors measure 3.7K to 3.9K. This is one way for me to ensure, that at these locations, BGA balls are making contact with PCB pads. But what are other vital signals coming out of DSP (that must be present for establishing "Target Connection") which can be monitored on DMM / Scope to ensure that the BGA is indeed making contact with pads ?

    As referred in Analog Devices website, we are following "IPC/JEDEC J-STD-020D.1" for mounting of BGA. As per this standard, the Peak package body temperature (Tp) for Pb-Free devices is 260 deg. But we needed to raise the temperature to almost 300 Deg for this BGA to work (that too after re-flowing it couple of times). We are using top & bottom heat blower for re-flow assembly. Which specific re-flow profile would you recommend for this mounting this BGA? Is there a resource where I can get some more help about correct temperature re-flow profile of ADSP TS101 ?

     

    Regards

     

     

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