Package Information needed for Innovasic: IA6805E2

Hello - 

I have a design which uses the IA6805E2 microprocessor and need package information to do a Tin Whisker Analysis.

Can I get information such as:

   # Lead Finish Material

  #  Process (Electroplate, Immersion, Hot Dip)

   # Material Directly Beneath (brass, Cu, Fi, Ni, other)

  #  Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)

  #  Is plating heated after deposition (No, Annealed, Fused) 

Thank You!

Mike

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  • 0
    •  Analog Employees 
    on May 23, 2019 7:19 PM
    • Lead Finish Material ( Matte Tin)

                    Lead finish material is Matte Pure Tin(100% Sn)

    • Process (Electroplate, Immersion, Hot Dip)

              Apply Electro Plating

    • Material Directly Beneath (brass, Cu, Fi, Ni, other)

    CDA 194 standard Cu alloy

    • Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)

                    Apply JEDEC  or  Military standard for Lead frame material controlling

    • Is plating heated after deposition (No, Annealed, Fused)

                    Annealed 150 C /  1 Hr

Reply
  • 0
    •  Analog Employees 
    on May 23, 2019 7:19 PM
    • Lead Finish Material ( Matte Tin)

                    Lead finish material is Matte Pure Tin(100% Sn)

    • Process (Electroplate, Immersion, Hot Dip)

              Apply Electro Plating

    • Material Directly Beneath (brass, Cu, Fi, Ni, other)

    CDA 194 standard Cu alloy

    • Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)

                    Apply JEDEC  or  Military standard for Lead frame material controlling

    • Is plating heated after deposition (No, Annealed, Fused)

                    Annealed 150 C /  1 Hr

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