I have a design which uses the IA6805E2 microprocessor and need package information to do a Tin Whisker Analysis.
Can I get information such as:
# Lead Finish Material
# Process (Electroplate, Immersion, Hot Dip)
# Material Directly Beneath (brass, Cu, Fi, Ni, other)
# Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)
# Is plating heated after deposition (No, Annealed, Fused)