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Package Information needed for Innovasic: IA6805E2

Hello - 

I have a design which uses the IA6805E2 microprocessor and need package information to do a Tin Whisker Analysis.

Can I get information such as:

   # Lead Finish Material

  #  Process (Electroplate, Immersion, Hot Dip)

   # Material Directly Beneath (brass, Cu, Fi, Ni, other)

  #  Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)

  #  Is plating heated after deposition (No, Annealed, Fused) 

Thank You!