I have a design which uses the IA6805E2 microprocessor and need package information to do a Tin Whisker Analysis.
Can I get information such as:
# Lead Finish Material
# Process (Electroplate, Immersion, Hot Dip)
# Material Directly Beneath (brass, Cu, Fi, Ni, other)
# Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)
# Is plating heated after deposition (No, Annealed, Fused)
Hi Mike,It seems this case needs to handle by Analog Microcontrollers. Since, I can't move this post to the ez.analog.com/.../ forum.Can you post it there ?Regards,Lalitha.S
Lead finish material is Matte Pure Tin(100% Sn)
Apply Electro Plating
CDA 194 standard Cu alloy
Apply JEDEC or Military standard for Lead frame material controlling
Annealed 150 C / 1 Hr
Thank You!That is the information that I needed.