Does ADI have any EMC performance data it can share on the differences in performance / emission between the BGA and QFN packages (e.g., BF707 and BF706) in an apples-to-apples situation?
I am aware that the QFN88 has a very large thermal ground pad as pin 89, but having only one other ground lead ( pin 76 ) makes me wonder if it is noisier than the BGA package.
I'm afraid I only have data for the BGA package. If you e-mail email@example.com with "Attention Joe T" in the subject I can see if we're able to share the EMC data with you. In a previous product that had similar package options the BGA did have better EMC performance.
we observe severe problems with the EMI emission of the BF706-BCPZ-3 processor (QFN88-package) at its PLL harmonics. The oscillator is 25MHz and the processor strongly emits frequences of 275MHz, 300MHz, 325MHz and so on. Any ideas how to supress them ?
Sorry I didn't see this earlier. My first suggestion is to disable the SYS_CLKOUT pin and see if this makes a difference. You can also disable on-chip clocks that you aren't using such as DCLK.